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Company profile:
Shenzhen Danbond Technology Co., Ltd.
Country: China
Legal Representative: Zhong Qiang
Business status: Active
Industry: integrated circuit manufacturing
Company type: limited company
Founding date: 2001-11-20
Approval date: 2023-03-06
Chinese company name: 深圳*邦科技股份有限公司
Telephone: 0755-269815** ,0755-265115**
Email:
**fpc@danbang.com ,
**dbond@danbang.com ,
Shenzhen Danbond Technology Co., Ltd.
| Employees | 0-100 Detail | ( 72.48% of companies have fewer than 5 employees. ) |
|---|---|---|
| Registered capital | 547,920,000 RMB Detail | ( 6.3% of companies have registered capital less than 500,000. ) |
| Paid up capital | Over 100 Million RMB Detail | ( 42.7% of companies have paid up capital less than 500,000. ) |
| The preceding data analysis is derived from a sample of 2 million Chinese companies with import and export licenses, as of October 9, 2023. | ||
Company's Shareholders
other shareholders
Xu Hanbing
Li Le
Li Huafeng
Lin Wei
Hainan Dingxuan Investment Co., Ltd.
Shenzhen Danbang Investment Group Co., Ltd.
Shenzhen Haoshi Investment Enterprise (Limited Partnership)
Wang Shuchun
Xie Jinhe
Chen Rong
Xu Hanbing
Li Le
Li Huafeng
Lin Wei
Hainan Dingxuan Investment Co., Ltd.
Shenzhen Danbang Investment Group Co., Ltd.
Shenzhen Haoshi Investment Enterprise (Limited Partnership)
Wang Shuchun
Xie Jinhe
Chen Rong
They invested companies
Company's business scope
General business items are： Development of flexible copper clad laminates、 Liquid crystal polymer conductor material， High frequency flexible circuit、 Flexible circuit packaging substrate、 High precision integrated circuit、New electronic components、 Two-dimensional semiconductor materials、 polyimide film、 Quantum carbon based film、 multilayer graphene film、 shielding invisibility film， Provide technical consulting services for self-produced products，Operating import and export business（law、Administrative regulations、Except for items prohibited by the State Council，Restricted projects must obtain a license before operating），The licensing program is： Production and operation of flexible laminated copper sheets、 Liquid crystal polymer conductor material， High frequency flexible circuit、 Flexible circuit packaging substrate、 High precision integrated circuit、New electronic components、 Two-dimensional semiconductor materials、 polyimide film、 Quantum carbon based film、 multilayer graphene film、 shielding invisibility film。
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location of Shenzhen Danbond Technology Co., Ltd.
| Address | Danbang Technology Building, Langshan 1st Road, High-tech Park, Nanshan District, Shenzhen |
|---|---|
| Province | Guangdong  |
| City | Shenzhen |
Ranking of Shenzhen Among Chinese Cities
Area of Industrial, Manufacturing of the city(Shenzhen )
Area: 273.42 km²
Chinese city rankings: 4
Population of the city(Shenzhen )
Population: 17,682,000
Chinese city rankings: 4
Companies in the city(Shenzhen)
Companies: 140,270
Chinese city rankings: 1
Area of Logistics and Warehouse of the city(Shenzhen )
Area: 20.24 km²
Chinese city rankings: 12
Frequently Asked Questions
1.Company information
Email:**dbond@danbang.com
Phone number:0755-269815**
The company was started in 2001-11-20