Founding date
2017-12-13
Registered capital
5,000,000 RMB
Employees
0-100
Industry
Other unspecified information technology service industry
Business scope: High Thermal Conductivity Material, High Thermal Conductivity Material, Integrated Circuit Ceramic Substrate, Mirror Aluminum Substrate, Bt Board, Insulating Materials And Metal Based Electronic Materials, Energy Saving Lighting Engineering Design, Insulating Materials And Metal Based Electronic Materials, Copper Substrate, Copper Substrate, Automotive High Power Component Carrier Board, Automotive High Power Component Carrier Board, Bt Board, Artificial Intelligence Automation Equipment, Import And Export Of Goods And Technology, Law, Installation And Technical Service, Integrated Circuit Ceramic Substrate, Mirror Aluminum Substrate, Semiconductor Package Substrate, ...

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