Manufacturing of electronic components and electronic special materials
Business scope: Production,
Packaging And Testing Of Semiconductor Materials And Components,
Semiconductor Discrete Device Sales,
High Precision Ultra Thin Flexible Packaging Substrate,
Lsi,
Machinery And Equipment Leasing,
Non Residential Real Estate Leases,
Tape And Reel Flexible Ic Carrier Board Connection Chip,
Manufacturing Of Semiconductor Discrete Devices,
Technical Services,
Internet Sales,
Research And Development Of Electronic Components,
Sales And Technical Consultation,