Technology Development Of New Electronic Components (Chinese companies list)

Business scope: Technical Services, Production, Sale, Import And Export Of Goods And Technology, Multi Chip Module Carrier Board And Material, Redistribution Layer Material, System In Package Carrier Board, Chip Scale Package Substrates And Materials, Embedded Component Substrate And Material, Ball Grid Array Package Substrate And Materials, Field Programmable Gate Array Carrier Board And Materials, Materials For Integrated Circuits, Wholesale Of Electronic Products, Own House Rental, Ball Bump Carrier, Integrated Circuit Packaging Substrate, Technology Development Of New Electronic Components,

Business scope: Wholesale Of Electronic Products, Multi Chip Module Carrier Board And Material, Redistribution Layer Material, System In Package Carrier Board, Chip Scale Package Substrates And Materials, Embedded Component Substrate And Material, Ball Grid Array Package Substrate And Materials, Field Programmable Gate Array Carrier Board And Materials, Materials For Integrated Circuits, Integrated Circuit Packaging Substrate, Technology Development Of New Electronic Components, Own House Rental, Ball Bump Carrier, Technical Services, Production, Sale, Import And Export Of Goods And Technology,